10th International Symposium on Optical Interconnect in Data Centres
Tuesday, 24th September 2024: 9:00 – 17:15
Organisers: Tolga Tekin, Richard Pitwon, Nikos Pleros, Dimitrios Apostolopoulos, Paraskevas Bakopoulos
As part of the 50th European Conference on Optical Communication (ECOC 2024) in Frankfurt, we invite you to attend the 10th International Symposium on Optical Interconnects in Data Centres on Tuesday, September 24, 2024.
Hyperscale data centres are undergoing a paradigm shift with the rapid proliferation of Artificial Intelligence, necessitating disruptive innovations in optical interconnects. Addressing the power consumption bottleneck is critical for AI infrastructure providers.
Energy efficiency is being addressed at various levels within the hyperscale hierarchy. Innovations include novel WDM architectures, immersion cooling, optical and neuromorphic computing, and ultra-low-power optical phase change materials including EO polymers. We will also hear about the latest advances in Co-Packaged Optics versus Linear Drive pluggable optics.
With the increasing adoption of Quantum Dot lasers in mainstream transceivers, reliability has become increasingly important.
Furthermore, quantum technologies are making their way into hyperscale environments through Quantum Computing as a Service and quantum cryptography to safeguard critical communications to and from data centres.
Photonic Integrated Circuits (PICs) are the critical enabling technology throughout and we will hear on the latest advances in PIC technologies.
Session 1: OPTICS FOR HYPERSCALE AI
| Start | End | Title | Speaker | Organisation | Country |
| 9:00 AM | 9:15 AM | Optical I/O for AI Systems | Benjamin G. Lee | NVIDIA Research | United States |
| 9:15 AM | 9:30 AM | SDN architecture and AI usecases for optical communication networks | Oscar Gonzalez De Dios | Telefonica Innovacion Digital SL | Spain |
| 9:30 AM | 9:45 AM | PICs for coherent communication networks | Benjamin Wohlfeil | Adtran Networks SE | Germany |
| 9:45 AM | 10:00 AM | Carbon footprint considerations with optical transceivers evolution | Fabienne Saliou | Orange S.A. | France |
| 10:00 AM | 10:15 AM | Integrated optical I/O chiplets for bandwidth and performance scaling in AI infrastructure | Thomas Liljeberg | Intel Corporation | United States |
| 10:15 AM | 10:30 AM | Cambrian explosion in optical interconnects for AI Clusters | Vladimir Kozlov | LightCounting | United States |
Session 2: ADVANCES IN PIC
| Start | End | Title | Speaker | Organisation | Country |
| 11:00 AM | 11:15 AM | An analogue optical computer for machine learning and optimisation workloads | James Clegg | Microsoft Research | United Kingdom |
| 11:15 AM | 11:30 AM | Photonic Fabric for High-Performance Interconnects | Nikos Bamiedakis | Celestial AI | United States |
| 11:30 AM | 11:45 AM | An Overview of PIC Technologies for Quantum Communications | Taofiq K. Paraïso | Toshiba Europe Limited | United Kingdom |
| 11:45 AM | 12:00 PM | Scaling to large silicon photonic circuits in the PHORMIC project | Wim Bogaerts | Ghent University – imec | Belgium |
| 12:00 PM | 12:15 PM | Speeding up AI networking with software-defined optical engines | Ana Gonzalez | Ipronics Programmable Photonics, SL | Spain |
| 12:15 PM | 12:30 PM | Coherent Transceivers for AI-Drive Data Centers | Antonio Napoli | Infinera | Germany |
Session 3: OPTICAL CIRCUITS AND PACKAGES
| Start | End | Title | Speaker | Organisation | Country |
| 1:15 PM | 1:30 PM | Ultra-Compact VCSEL-Based Transceivers Employing High-Density Electrical Pluggable Interface for Co-Packaged Optics | Hideyuki Nasu | Furukawa Electric Co., Ltd. | Japan |
| 1:30 PM | 1:45 PM | Micro lenses for optical interconnects molded in a new reflow resistant EXTEM(TM) TPI resin | Jos van Gisbergen | SABIC | Netherlands |
| 1:45 PM | 2:00 PM | Silicon-organic hybrid electro-optic modulators for next generation optical interconnects | Adrien Mertens | SilOriX GmbH | Germany |
| 2:00 PM | 2:15 PM | Glass Substrate Integration of low loss optical Waveguides for e/o Interposer and automated testing | Henning Schroder | Fraunhofer IZM | Germany |
| 2:15 PM | 2:30 PM | Metallic Interconnects for Co-Packaged Photonic Integrated Circuits | Andrew Meek | Senko Advanced Components | United Kingdom |
| 2:30 PM | 2:45 PM | High density 3-dimensional polymer optical waveguide for co-packaged optics | Takaaki Ishigure | Keio University | Japan |
| 2:45 PM | 3:00 PM | High Performance Materials for Co-Packaged Optics | Habib Hichri | Ajinomoto Fine-Techno | United States |
Session 4: THE NEXT GENERATION
| Start | End | Title | Speaker | Organisation | Country |
| 3:30 PM | 3:45 PM | Large-Scale Integrated Photonic Device Platform for Energy-Efficient AI/ML Accelerators | Fabian Boehm | HPE Labs | Germany |
| 3:45 PM | 4:00 PM | POLYNICES Project – Integration of Polymer-Based Electro-Optic PCB Motherboards with Si3N4 Chiplets, InP Components, and ICs for Cost-Effective Photonic Modules | Christos Tsokos | Institute of Communication & Computer Systems “ICCS” | Greece |
| 4:00 PM | 4:15 PM | OCTAPUS Project – Optical Circuit switched Time sensitive network architecture for high-speed Passive optical networks and next generation Ultra-dynamic & reconfigurable central office environments | Chris Vagionas | Aristotle University of Thessaloniki | Greece |
| 4:15 PM | 4:30 PM | Broadband-tunable external cavity laser for intra-datacentre interconnects developed in DYNAMOS | Timo Aalto | VTT Technical Research Centre of Finland Ltd. | Finland |
| 4:30 PM | 4:45 PM | ADOPTION Project – Advance co-packaged optics enabling high-efficiency cloud computing | Giuseppe Talli | Huawei Technologies Duesseldorf GmbH | Germany |
| 4:45 PM | 5:00 PM | HAMR – integrating lasers and plasmonics for the ultimate high volume co-packaged optical assembly | Richard Pitwon | Seagate ; Resolute Photonics Ltd. | Ireland |